| • Organic exhaust (VEX) | |
| Photoresist development (isopropanol concentration 50–200 mg/m³), chemical vapor deposition (CVD tail gas containing hexamethyldisilazane), encapsulation and curing (epoxy resin volatiles accounted for 15–25%) | |
| • Acid venting (SCX) | |
| Etching process (HF concentration 80–150 ppm), cleaning exhaust gas (H₂SO₄ droplet size <5 μm), CMP grinding (nitric acid vapor flux 2–5 kg/h) | |
| • Alkaline exhaust (AEX) | |
| Developer exhaust gas (TMAH concentration 30–80 mg/m³), stripping process (KOH aerosol accounted for 40–60%) | |
| • Toxic exhaust (TEX) | |
| Decomposition of metal-organic sources (AsH₃, PH₃ concentration 0.5–3 ppm), electroplating exhaust gas (hydrogen cyanide escape rate <0.1%) | |
| • General exhaust (GEX) | |
| Clean room air exchange (VOCs background value <1 mg/m³), equipment cooling exhaust gas |
