| • Organic exhaust gas (VEX) | |
| Photoresist development (isopropanol concentration 50–200 mg/m³), chemical vapor deposition (CVD tail gas containing hexamethyldisilazane), encapsulation and curing (epoxy resin volatiles accounted for 15–25%) | |
| • Acidic exhaust gas (SCX) | |
| Etching process (HF concentration 80-150ppm), cleaning exhaust gas (H2SO4 mist droplet size <5μm), CMP polishing (nitric acid vapor flux 2-5kg/h) | |
| • Alkaline exhaust gas (AEX) | |
| Developer exhaust gas (TMAH concentration 30–80 mg/m³), stripping process (KOH aerosol accounteds for 40–60%) | |
| • Toxic exhaust gas (TEX) | |
| Decomposition of metal-organic sources (AsH₃, PH₃ concentration 0.5–3 ppm), electroplating exhaust gas (hydrogen cyanide escape rate <0.1%) | |
| • General exhaust (GEX) | |
| Air exchange from clean room (VOCs background value <1mg/m³), exhaust gas from equipment heat dissipation |
